• Workshop Overview
  • Committees
  • Call for Papers
  • Sponsors
  • Previous IMSTW
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  • Location
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  • Venue & Directions
  • Accomodation
  • Technical Program
  • Invited Speakers
  • Types of submissions
  • Relevant dates
  • Electronic submission
  • Camera-Ready


  • Workshop Overview

    One and a half decade ago the IEEE Mixed-Signal Test Workshop (IMSTW) was inaugurated as a forum focused on test and design for test issues related to systems encompassing digital and analog electrical signals. In view of accelerated developments in heterogeneous design and production, in 2008 IMSTW started to include new topics focusing on challenges and solutions associated with test, design for test, reliability and manufacturability of heterogeneous types of systems in emergence or envisaged in the near to longer terms. Renamed to include sensors and systems, the new IMS3TW aims to bring research and technical expertise for the next generation of devices, circuits and systems. IMS3TW will continue to address the traditional technology spectrum of IMSTW, in particular all aspects of analog, mixed-signal, and RF testing, but with increased attention to all aspects of current design complexity (e.g., parametric variability, power consumption, temperature effects). Guaranteeing design robustness for the new generation of nanoelectronic devices may need to exploit self-monitoring functionality (such as selftest/- calibration), allowing the circuit or system to adapt to varying circuit parameters or functional demands. Builtin sensors can play a crucial role to facilitate device adaptability and are therefore within the scope of IMS3TW.

    Primary Topics of Interest include:

    Test & Design for (on/off-line) Test

    Verification & Design for Verification

    Reliability & Design for Reliability

    Monitoring/Diagnosis & Design for Debug/Diagnosis

    Fault and Error Modelling & Simulation

    Fault Tolerance


    Pertaining to the following systems or underlying technologies:

    Analog/Mixed-Signal Circuits
    Biomedical Circuits & Systems

    Lab-on-Chip
    MEMs

    RF & Wirelessly Controlled Devices

    Microfluidics

    Optoelectronics & Photonics

    Heterogeneous Systems

    Drug Delivery Microsystems

    Implantable Devices

     
    Key Dates
    Submission deadline: February 20, 2009
    Notification of acceptance: April 10, 2009
    Camera-ready full papers: May 15, 2009

    Sponsors